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Solder Paste Jet Printer Dispenser Mycronic MY700JD
Specifications:
Solder Paste Jet Printer Dispenser Mycronic MY700JD
Accurate: Maintains high positional accuracy at throughputs at least three times higher than general dispensers.
Simple: Replaces multi-head solutions with one machine. Applicator with low parts count simplifies service and maintenance.
Flexible: Dual-head option allows dispensing of two different assembly fluids in one process step.
Reliable: Well-proven design, compatible with a wide range of industry fluids.
The highest throughput in a range of dispensing applications
Low- and high-viscosity adhesives. Selective coating, capillary underfill and encapsulation. The MY700 Jet Dispenser handles it all at substantially higher speeds than any other dispensing system — no matter what type of board you are producing.
Maximum productivity
With a throughput rate vastly higher than traditional glue dispensers, the MY700JD is the market’s fastest dispensing platform. Its dual-head, dual-lane design with faster board loading and on-the-fly fiducials makes it ideally suited for operator-free, high-volume manufacturing where the absolute highest levels of speed and precision are a necessity. The platform’s advanced motion system makes quick work of complex SMA and random dot patterns as well as long travel distances.
Minimal maintenance
The non-contact jetting Nozzles are robust and durable, and require minimal maintenance thanks to an integrated valve cleaning station. Applicator heads have few wetted parts, all of which are easily accessible, which means the unit can remain on the machine during maintenance to ensure low running costs and minimal stoppage time. Whenever machine cleaning is required, the MY700JD’s compact format and dual hoods allow easy access from either the front or back of the machine.
Intelligent guidance
To ensure error-free operations, each applicator includes an ID chip and barcode on the cartridge, which guarantees that the right applicator for the job is used. With a vast and expanding range of approved fluids, the MY700JD gives you enormous versatility for future applications, together with vastly improved throughput and minimal operator intervention.
MACHINE PLATFORM
Jet frequency
720,000DPH/1,080,000DPH(1)
Gantry type
X /Y linear motor
Servo
Advanced DSP motion control
Gantry acceleration, max
3g (30m/s2)
Active field of view
16 x 16 mm
PRODUCTION PERFORMANCE
Single dot repeatability, 3σ (X,Y)(2)
± 35μm
Single dot accuracy, Cpk = 1.0 (X,Y)(2)
± 40μm
CAPABILITY
MY700JX
MY700JP
MY700JD
Media
Solder paste
SMA and other adhesives
Applicator type
Piezo ejector
Pneumatic valve/Piezo valv
Droplet size
1 .9 –35nl(3)
5 –1,000nl
Min dot diameter
210μm(3)
200μm
(this is material dependent)
Nozzle sizes
N/A
50 – 400μm
Syringe size
30 cc
5, 10, 30 cc
OPTIONAL FEATURES
MY700JX
MY700JP
MY700JD
Hermes communication
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2D inspect and repair — paste present detection
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High speed — 1,080,000dph
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SMD adhesive — jet printing of SMA
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Fine pitch — jet printing for fine pitch components
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Shared databases
•
•
PCB ID — board traceability
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•
Serial start — automatic start
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•
Dual layout
•
•
Dual heads
•
•
Board indexing
•
•
Cleaning station for ejector
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Cleaning station for applicator
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Internal buffering 200 mm
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Internal buffering 250 mm
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Extended Internal Conveyor — For boards up to 915 mm in length
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Foot SMEMA — spacer for SMEMA height
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Vacuum clamping
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Fiducial recognition on-the-fly
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Stop pin
•
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Weigh station
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AI2 — active inspection interface, repair loop
•
E-mapping — external information; “bad board” and “fiducial”
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•
Board thickness range(4)
0.4 – 6 .0 (0.016”– 0.24”)
Overboard clearance
35 mm (1 3/8”)
Underboard clearance
25 mm (1”)
Board edge clearance, top
3 mm (1/8”)
Board edge clearance, bottom
4 mm (5/32”)
Board warp / bow / twist, max(5)
± 2 mm (± 0.08”)
Board weight, max
5 kg (11lbs)
Board transport height
880 – 930 mm (34 .6”–36 .6”)
Board transport height (SMEMA)
930 – 975 mm (36 .6”–38 .4”)
Transport direction
R->L, L->R, R->R, L->L, Pass
Lane configuration
Dual lane with optional dual layout
Machine weight
1,600kg (3,530lbs)
System Footprint
843 x 1,550 mm
Power requirements
4kW (peak)
Power consumption
3kVA
Voltage
3 phase AC 200/ 220/ 240/ 380/ 400/ 420V ± 10 %
Air pressure
5 –10 bar (70 –140PSI)(9)
Air quality
ISO 8573-1 4 4 4
Air consumption, max
250 l/min (9CFM)
Ambient temperature
+ 18°C to + 32°C, 30 – 80 % RH
Clean room
Fulfills class 10,000
Altitude
Lower than 1,000 m above sea level
Sound level
68dB(A)
Keywords:
SMT Stencil printer, SMT solder paste printer, SMT printing machine, SMT PCB printer, 600mm Solder paste printer, 1200mm solder paste printer, Solder paste printer, GKG stencil printer, GKG printer.
Contact: Mr Tommy
Phone: +86 13691605420
Tel: +86 -755-85225569
Email: sales@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China