FUJI NXT III SMT Assembly Line

Products description:

FUJI NXT III SMT Assembly Line

FUJI NXT III SMT Assembly Line, this full automatic SMT assembly line with 8 set FUJI NXT III pick and place machine, suitable for High output PCB production, like consumer proudcts PCB, Mobile phone PCB and other middle size PCB with daily output 10000pcs.

1. PCB loader

Micro computer controlled component ensures machine’s stable and reliable running.
Optional Fuji buttons interface or touch panel interface, convenient man-machine interaction.
Multiple sound and light alarming functions
Use standard magazines, good compatibility, load with 3 magazines at one time.
Lifting distance adjustable according to PCB, 4 kinds of distance(10mm, 20mm, 30mm and 40mm)
Loader configured with inner push board component, save the cost of buying PCB moving machine independently.

Automatic counting function make it easy of production statistic
Optional SMEMA port for communication between machines.

A Seriel SMT Stencil printer is high accuracy and high stability of the fully automatic printing machine vision,We followed in SMT industry is the development trend of production of a new generation of fully automatic printing machine with the international leading technology synchronous vision, visual processing of high resolution, high precision of the transmission system, suspension adaptive scraper.
Specification ：
A Series High Precision Automatic solder paste printer designed for high precision
steel mesh printing or stencil printing in SMT industry.
Printing PCB size：50mm x 50mm ~1200mm x 800mm;
PCB thickness: 0.4mm ~ 14mm
FPC thickness: ≦0.6mm (Excluding jig)
Applicable pitches of Components
SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications;
IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3mm; support BGA, CSP packaging,
min. ball 0.2mm;
Applicable PCB Types
Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics,
medical power equipment, aerospace and aviation, besides general electronics products.

PCB size:
Minimum: 48mmx48mm
Maximum: 510mmx534mm
(Single handling track)
Patch speed:
H12HS: 22,500; H08: 10,500; H04: 6,500; H01: 4,200
Patch accuracy:
H12S / H08 / H04: 0.05mm (3sigma) cpk≥1.00
Patch range:
H12S: 0402 ~ 7.5x7.5mm high: MAX: 3.0mm
H08: 0402 ~ 12x12mm high: MAX: 6.5mm
H04: 1608 ~ 38x38mm high: MAX: 13mm
H01 / H02 / OF: 1608 ~ 74x74mm (32X180mm) High: MAX: 25.4mm

4. high production Capacity Reflow oven KTR 1000.

1. Reinforced main hanging bracket to guarantee there is no deforming and board jamming occurred.

2. The dual-rails conveyor is able to improve the production efficiency as well as power & cost.

3. 15% heat transferring efficiency was improved to deal with the lead free process with more complicated and larger products.

4. New cooling configuration to make the filtered or reclaimed air back to oven chamber, it reduced the thermal loss as well as get better flux reclamation.

5. User the full protection of the sealed oven design to prevent N2 and O2 from losing effectively. So the lowest concentration of N2 and O2 can be reached to 150 PPM.

6. When Concentration of oxygen is 300-800 PPM, consumption is only 20-22M3/H.

Keywords:

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