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DEK E Seriels SMT Stencil Printer E by DEK
Specifications:
DEK E Seriels SMT Stencil Printer
E-Quality
DEK’s experienced printing specialists have developed an innovative platform for E by DEK with high-quality components, sophisticated construction, and modular design that guarantees a stable and reliable printing process even for the latest fine-pitch applications.
E-Performance
The E by DEK delivers E-Performance with:
8 seconds core cycle time
Fast setup changeovers
High repeatability
With the shortest cycle times and the fastest product changeovers paired with maximum repeat accuracy, the E by DEK sets new standards in the mid-speed segment.
E-Facts
Clearly structured, and each number provides a strong argument: The most important facts and figures on the E by DEK.
* Alignment qualifications include board loading/unloading, board clamping, camera/table movement. Capability value is calculated with 3rd-party QC-Calc software.
# Machine capability comprises board loading/unloading, board clamping, camera/rising table movement and print process. The capability value is calculated with 3rd-party QC-Calc software.
E By DEK
Flexibility at its best!
Each SMT factory has its own special challenges. That is why we have developed Options for the E by DEK that allow custom tuning with perfectly coordinated modules for printing results that will make your customers happy and raise your SMT production to a new level.
E by DEK Options for all your applications:
Throughput
Quality
Flexibility
Long and heavy circuit boards
Alignment |
> 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
System alignment capability |
> 2.0 Cmk @ ± 25 μm (± 6 sigma) |
Optimum core cycle time |
8 seconds |
Substrate size |
50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) |
Operating System |
Windows 7 Embedded |
Squeegee pressure mechanism |
Software-controlled, motorized with closed loop feedback |
Stencil positioning |
Semi-auto stencil load with drip tray |
Understencil cleaning |
Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe |
Adjustable-width stencil mount (AWSM) |
Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm |
Substrate thickness |
0.2 mm to 6 mm |
Substrate weight (maximum) |
6 kg |
Substrate warpage |
Up to 7 mm including substrate thickness |
Substrate fixture |
Over the top clamp Edge clamp Foil-less clamp Vacuum |
Temperature & humidity sensor |
Monitoring of the process environment |
Keywords:
SMT Stencil printer, SMT solder paste printer, SMT printing machine, SMT PCB printer, 600mm Solder paste printer, 1200mm solder paste printer, Solder paste printer, GKG stencil printer, GKG printer.
Contact: Mr Tommy
Phone: +86 13691605420
Tel: +86 -755-85225569
Email: sales@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China