Alpha 0.81MM Solder Wire SACX0307

Products description

Alpha 0.81MM Solder Wire SACX0307

Brand:ALPHA (Alpha)
model:SACX0307
Wire diameter:0.81MM
Specification:1000g/roll
alloy composition:Tin Silver Copper (Sn99/Ag0.3/Cu0.7)
Melting point:217-228°C
Flux content:2.0%, 2.2%.2.8%
Wire diameter:(￠0.38mm, ￠0.51mm, ￠0.64mm)---500g/roll;
(￠0.81mm, ￠1.02mm, ￠ 1.27mm, ￠1.57mm￠2.0mm) 1KG/roll;
Common Solder wire:Lead tin wire: Sn63/Pb37
Lead-free Solder wire:

SAC 305: (Sn96.5Ag3.0Cu0.5)
SACX0307: (Sn99-0.3Ag-0.7Cu)
Operating temperature:
The reference temperature (370±20℃) can be adjusted with the thickness of the tin wire diameter.

ALPHA SACX0307 lead-free tin wire: High-quality ALPHA solder wire products from Believe Electronics are specially used for manual soldering of components and SMT assembly rework welding:
1. Suitable for all manual and machine automatic welding, component assembly and repair;
2. High soldering ability, extremely low or no flux residue corrosion;
3. The flux cores are evenly distributed, ultra-low and cheap;
4. Very strong weldability;
Features:
ALPHA Alpha solder wire has different chemistry and flux content percentage, which is suitable for manual soldering and automatic soldering.
The no-clean solder core has activity similar to most RMA-type fluxes and the residue is transparent.
The water-soluble core can provide excellent wettability, and the joints will be bright after welding. It is specially designed for the process of water cleaning.
Both RMA and RA cores comply with IPCJ-STD-006 and JIS Z 3283AA/A standards. These fluxes can be dissolved in solvents, and have the characteristics of less smoke and not easy to splash
Flux content: The content ranges from 1.2% to 3.5%. For most applications, the recommended flux content is 1.8 to %2.0.
The anti-oxidation solder wire and superior melting property reduce the production of non-melting tin, which is especially suitable for wave soldering furnace. The effect of using the hand immersion furnace is even better.
Improve the diffusion ability of solder, strengthen the solidification, reduce the occurrence of undesirable conditions such as bridging, tin tip, etc., so that the soldering effect is better and more stable.
Significantly reduce the oxidation reaction of the solder, prevent the solder surface from turning into yellow and brown, and stably maintain the bright “mirror” surface of the solder, thereby reducing its production cost.

Keywords:

SMT Peripheral Equipment, PCB Loader, PCB Unloader, SMT PCB Conveyor, SMT PCB Cleaning Machine, DIP Insert Line, SMT NG/OK Unloader, SMT Shuttle Conveyor.