ALPHA wave soldering flux EF-6100P

Products description

ALPHA wave soldering flux EF-6100P

Product name:Flux
Cleaning type:No cleaning
Solder joint chromaticity:Bright type
Brand:Alpha
Ingredients:Rosin Ethylene Propanol
model: 6100-6100P series
Package: Available in 5 gallons and 55 gallons
Scope of application: Wave soldering flux
Our company has been selling the following products of Alpha Flux in large quantities for a long time:
Rosin flux: RF800/RF800T/RF800H/100/615-15/EF8000/EF8000GL/EF2202/WS36225/615-25
Resin flux: NC200/EF9301/EF6100/EF6100P/NR205/NR330/LS500A/9230B/9230
Halogen-free flux: SLS65/SLS65C/SLS65H
Stainless steel flux: 90
Thinner: 800ADD/411
Cleaning agent: SC-10/SC-7525
Flux is a chemical substance that promotes soldering. In soldering, it is an indispensable auxiliary material, and its role is extremely important.
(1) Dissolve the oxide film on the surface of the base metal to be welded
(2) Prevent the re-oxidation of the base metal being welded
(3) Reduce the surface tension of molten solder
Features and advantages:
• Conforms to Bellcore surface insulation resistance (SIR) regulations, so it is suitable for components that require compliance with this standard.
• No volatilization, which helps to meet air quality regulations.
• Outstanding wettability and top surface hole filling performance is even suitable for bare copper boards coated with organic solder preservative (OSP) that have been previously reflow soldered.
• Contains thermally stable activator to reduce the occurrence of flux bridging.
• Reduce the surface tension between the solder mask and the flux, thereby reducing the occurrence of solder balls.
•Suitable for selective soldering process.
• The board surface is extremely clean after welding. There is little residue and no stickiness, which can reduce the interference to the pin test, and the board surface is clean after welding.
•Performs well in tin-lead and lead-free processes.
The performance that the flux should have:
(1) The flux should have an appropriate active temperature range. It starts to work before the solder melts, and plays a better role in removing the oxide film and reducing the surface tension of the liquid solder during the soldering process. The melting point of the flux should be lower than the melting point of the solder, but it should not be too different.
(2) The flux should have good thermal stability. Generally, the thermal stability temperature is not less than 100°C.
(3) The density of the flux should be less than that of the liquid solder, so that the flux can spread evenly on the surface of the soldered metal, covering the solder and the surface of the soldered metal in a film form, effectively isolating the air, and promoting the solder to the base material. Wetting.
(4) The residue of the flux should not be corrosive and easy to clean; no toxic and harmful gases should be precipitated; it should have water-soluble resistance and insulation resistance that meet the regulations of the electronics industry; it should not absorb moisture or produce mold; its chemical properties should be stable. , Easy to store.

Keywords:

SMT Peripheral Equipment, PCB Loader, PCB Unloader, SMT PCB Conveyor, SMT PCB Cleaning Machine, DIP Insert Line, SMT NG/OK Unloader, SMT Shuttle Conveyor.