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3D In line Solder Paste Inspection Machine F510
Specifications:
3D In line Solder Paste Inspection Machine F510
TECHNICAL PARAMETERS:
Inspection Principle:Programmable phase contour modulation measurement techniques(PSLM PMP)
Inspection type:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component: 01005.
Accuracy: XY=10 um,Height = 0.37 um.
Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).
Maximum Loading PCB Size(X*Y): 470x470mm.
Inspection Speed: 0.42 SEC/FOV.
FiducialDetection Time: 0.3sec/piece.
Maximum inspection height:±450um.
RGB Tune patented technology.
D-lighting patented technology.
Dynamic contour with coaxial telecentric lens perfect processing flexible circuit board testing.
Barcode function with traceability.
Badmark transfer function to mounters.
Access IMS system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.
Keywords:
SMT AOI Machine, Offline AOI Machine, Inline AOI Machine, SMT X Ray Machine, SMT SPI Machine, 3D SPI Machine, 3D AOI Machine.
Contact: Mr Tommy
Phone: +86 13691605420
Tel: +86 -755-85225569
Email: sales@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China