Lead Free SMT Solder Paste Screen Printing Oubel 500g RoHS Approved

Products description

no clean lead free solder paste for screen stencil printing Oubel 500g
Detailed Product Description
1. Introduction:
Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.

The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. 

2. Chemical Component Data Sheet:
Sort Chemical composition (wt.%)
Sn Pb Sb Cu Bi Ag Fe Al Cd
Sn96.5Ag3.0Cu0.5 Bal. < 0.10 <0.10 0.5±0.1 <0.10 3.0±0.05 <0.02 <0.002 <0.002

3. Physical Properties:


Sort Melting Point (℃) Spec. Gravity (g/cm3) Tensile Strength (MPa)
Sn96.5-Ag3.0-Cu0.5 217-219 7.40 53.

4. Our Superiority is the Professionalism of our team.


- PCB And PCB Assembly For One-stop Service with Original Components According the BOM.


IC Imported from Digikey / Farnell etc.


- Low Cost with High Quality, Commitment of Quality Assurance.


- For 10 years Experience in PCB Field. ( Our Factory owns advanced


production equipment and experienced technical personnel. )


5. Detailed specification of manufaturing capacity:


NO Item Craft Capacity
1 Layer 1-30 Layers
2 Base Material for PCB FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material
3 Rang of finish baords Thickness 0.21-7.0mm
4 Max size of finish board 900MM*900MM
5 Minimum Linewidth 3mil (0.075mm)
6 Minimum Line space 3mil (0.075mm)
7 Min space between pad to pad 3mil (0.075mm)
8 Minimum hole diameter 0.10 mm
9 Min bonding pad diameter 10mil
10 Max proportion of drilling hole and board thickness 1:12.5
11 Minimum linewidth of Idents 4mil
12 Min Height of Idents 25mil
13 Finishing Treatment HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
14 Soldermask Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
15 Minimun thickness of soldermask 10um
16 Color of silk-screen White, Black, Yellow ect.
17 E-Testing 100% E-Testing (High Voltage Testing); Flying Probe Testing
18 Other test ImpedanceTesting,Resistance Testing, Microsection etc.,
19 Date file format GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20 Special technological requirement Blind & Buried Vias and High Thickness copper
21 Thickness of Copper 0.5-14oz (18-490um)

Keywords:

SMT Peripheral Equipment, PCB loader, PCB unloader, PCB conveyor, PCB cleaner, Nozzle cleaner, PCB destacker loader, Reflow Oven thermal profiler, PCB NG/OK machine, DIP insert line, Solder paste mixer, SMT Stencil Cleaning machine.