Specification of ASM SMT Placement

High speed ASM pick and place machine, ASM SMT placement, SMD chip shooter, SIPLACE SX chip shooter for high-mix electronics production.

Our placement solution for high-mix electronics production
With the SIPLACE SX, your factory is ready for anything that comes along.
The SIPLACE SX was designed to be flexible. It is the world’s only platform that lets you scale up or down or transfer capacity by adding or removing the unique SX gantries.
Absolute precision and maximum performance have made the SIPLACE X-Series S the placement platform of choice for demanding high-volume production applications such as network infrastructure (5G), large boards for server and industrial segments. Wherever top speed, lowest dpm rates, non-stop setup changeovers, fast new product introductions and the high-speed placement of the latest generations of super-small components (0201 metric) are needed – the SIPLACE X-Series S delivers.
With the SIPLACE SX we have made our most successful placement solution even better:
1. Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily
2. The SIPLACE SpeedStar – faster, more precise, and longer-lasting
3. SIPLACE TwinStar: The head for special tasks
4. SIPLACE MultiStar: Switches between placement modes on demand
5. ASM smart transport modules: Process PCBs with lengths of up to 1.525 meters
6. LED centering: Align components based on top-side features
7. Place critical components reliable with the SIPLACE (OSC) Package
8. Touchless placement: Maximum placement quality for highly sensitive components
9. SIPLACE SpeedStar and SIPLACE MultiStar heads can operate jointly in the same placement area for more flexibility and performance.
10. Minimum placement force: 0.5 N
11. SIPLACE Smart Pin Support: Automated pin support for printed circuit boards
12. NEW: ASM Shuttle Extension: Active transport unit for easy management of single and dual conveyors
13. NEW: Up to 17% higher performance